U.S. Unveils Strategic Initiatives to Halt China’s Semiconductor Advance, Highlight on Superior Packaging in International Tech Rivalry

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In an effort to impede China’s entry to cutting-edge chipsets and semiconductor gear, President Joe Biden and U.S. officers have devised two strategic initiatives. This transfer goals to curtail Beijing’s technological development whereas concurrently bolstering home chip manufacturing. The focus of this new international tech rivalry is superior semiconductor packaging, a facet that specialists argue has been uncared for for too lengthy.

The U.S. authorities is directing substantial consideration and subsidies towards attracting chip producers to the nation. Consultant Jay Obernolte, a California Republican and one of many vice-chairs of the Congressional Synthetic Intelligence Caucus, emphasised the vital significance of semiconductor packaging, stating that the semiconductor ecosystem’s progress is contingent on giving packaging due prominence. Obernolte cautioned towards in-house packaging growth, emphasizing that it might yield no optimistic influence.

Historically thought of back-end manufacturing, Packaging, Meeting, and Testing (PAT) have traditionally acquired much less focus, innovation, and productiveness in comparison with front-end chip manufacturing. Nonetheless, the panorama is evolving quickly as new applied sciences facilitate the stacking and mixing of chips, marking an trade inflexion level.
Whereas superior packaging alone could not allow China to compete with the U.S. semiconductor progress, specialists imagine it could help the U.S. in crafting quicker, cost-effective computing programs by carefully integrating varied chips. This technique might permit China to protect its high-priced, limited-quantity chip expertise.

China, beneath the Made in China program introduced by Premier Xi Jinping in 2015, has prioritized the event of semiconductor packaging expertise. Though China trails the U.S. and Taiwan in superior semiconductor packaging, it’s making vital strides in wafer processing on a big scale.

China possesses a considerable quantity of back-end services and is house to the world’s third-largest Meeting, Testing, Marking, and Packaging (ATMP) agency, JCET Group, following Taiwan’s ASE Group and the U.S.’s Amkor Know-how in revenue rating. Chinese language corporations are aggressively rising market share, with JCET’s current acquisition of a cutting-edge manufacturing facility in Singapore and the institution of a state-of-the-art packaging unit in Jiangyin.

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